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The
ASK SPiD is a comprehensive contactless solution specifically
designed for ID documents. Added as an extra component, the SPiD can
be glued onto an existing ID document. Even better, the SPiD can be
set directly onto the secure paper prior to its personalization. For
example, in the case of the e-passport, the antenna can be printed
directly onto the passport cover, adding a new security feature, as
the RF assembly -the chip and antenna- cannot be delaminated from
its support, such attempt destroying the contactless feature.

SPID e-Cover is based on advanced
microcoprocessor chips with memory capacity varying from 2Kbytes up
to 64Kbytes of EEPROM, and is a full ISO14443 solution - type A and
type B. SPID is equipped with an ICAO compliant OS, which includes
the support for a PKI infrastructure with DES, 3DES and RSA crypto
algorithms. Additional software components are available facilitating
the establishment of the security and personalisation infrastructure.

SPID e-Cover packaging for
the e-passport has been tested with many national printing companies.
This ICAO compliant solution can be added to new passports without
changing the existing passport manufacturing process.

SPID e-Cover successfully went
through extensive mechanical tests including torsion, bending and
stamp tests, or temperature and humidity tests.

SPID e-Cover packaging benefits
from an innovative manufacturing process. The RF antenna is printed
directly on a paper substrate. Adding a die chip, the end product
is less than 250µm thick, the thinnest available solution, while
benefiting from outstanding mechanical characteristics.

Download
SPiD PDF product sheet
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