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SPiD: a unique solution to secure ID Documents



The ASK SPiD is a comprehensive contactless solution specifically designed for ID documents. Added as an extra component, the SPiD can be glued onto an existing ID document. Even better, the SPiD can be set directly onto the secure paper prior to its personalization. For example, in the case of the e-passport, the antenna can be printed directly onto the passport cover, adding a new security feature, as the RF assembly -the chip and antenna- cannot be delaminated from its support, such attempt destroying the contactless feature.

SPID e-Cover is based on advanced microcoprocessor chips with memory capacity varying from 2Kbytes up to 64Kbytes of EEPROM, and is a full ISO14443 solution - type A and type B. SPID is equipped with an ICAO compliant OS, which includes the support for a PKI infrastructure with DES, 3DES and RSA crypto algorithms. Additional software components are available facilitating the establishment of the security and personalisation infrastructure.

SPID e-Cover packaging for the e-passport has been tested with many national printing companies. This ICAO compliant solution can be added to new passports without changing the existing passport manufacturing process.

SPID e-Cover successfully went through extensive mechanical tests including torsion, bending and stamp tests, or temperature and humidity tests.

SPID e-Cover packaging benefits from an innovative manufacturing process. The RF antenna is printed directly on a paper substrate. Adding a die chip, the end product is less than 250µm thick, the thinnest available solution, while benefiting from outstanding mechanical characteristics.

Download SPiD PDF product sheet
 
     
 
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