SPiD is a contactless solution specifically designed for electronic passports. SPiD is available as a paper or Teslin inlay to be inserted into the passport cover or as a polycarbonate inlay to be laminated into a datapage. Both inlays and eCovers belong to the SPiD range.
The SPiD e-Cover complies with ICAO standards and has been tested in terms of durability with many national printing houses. SPiD is specifically designed to be embedded by current passport manufacturing houses without equipment changes.
SPiD successfully went through extensive mechanical tests including torsion, bending, and stamping, as well as temperature and humidity tests in independent laboratories such as PIRA laboratory.

PDFDownload the SPiD PDF product sheet